Summary of 6 common laser processes

Laser marking process:

   Laser marking is one of the biggest application fields of laser machining.Laser marking is a marking method which USES a high energy density laser to illuminate the workpiece locally, make the surface material vaporize or produce a chemical reaction of color change, and thus leave a permanent mark.Laser marking can produce a variety of text, symbols and patterns, character size can be from millimeter to micron scale, which has special significance for the anti-counterfeiting of products.

Laser drilling technology:

   Laser drilling technology has become one of the key technologies in the field of modern manufacturing because of its advantages such as high precision, high versatility, high efficiency, low cost and remarkable comprehensive technical and economic benefits.

Laser welding process:

   It has the effect of dissolving pool purification, can purify weld metal, suitable for welding between same and different metal materials.The high energy density of laser welding is particularly favorable for metal welding with high melting point, high reflectivity, high thermal conductivity and great difference in physical properties.Laser welding, in which a laser beam with less power than the one used to cut the metal melts the material rather than vaporizing it, becomes a continuous solid structure after cooling.
 

Laser cutting process:

Applied in the processing of metal and non-metal materials, it can greatly reduce the processing time, reduce the processing cost and improve the quality of the workpiece.Pulsed laser is suitable for metallic materials, continuous laser is suitable for non-metallic materials, the latter is an important application field of laser cutting technology.

Laser de-balancing process:

In order to achieve dynamic balance, laser is used to remove the unbalanced and heavy parts on the high-speed rotating parts and make the inertia axis coincide with the rotation axis.Laser deweighting technology has two functions: measurement and deweighting, which can simultaneously measure and correct the imbalance, greatly improving the efficiency, and has a broad application prospect in the field of gyro manufacturing.For high-precision rotors, laser dynamic balance can improve the balance accuracy, the balance accuracy of mass eccentricity value can reach 1% or a few thousandths of a micron.

Laser etching process:

Compared with the traditional chemical etching process, it can greatly reduce the production cost, and can process lines 0.125 ~ 1 micron wide, which is very suitable for the manufacture of ultra-large scale integrated circuits.